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型号
品牌
封装
MT25QL256ABA8ESF-0SIT
micron(镁光)
-
GD25LE64ELIGR
GigaDevice(兆易创新)
WLCSP(2x4)
MT25QL256ABA1EW9-0SIT TR
micron(镁光)
WPDFN-8(6x8)
GD25B512MEYIGR
GigaDevice(兆易创新)
DFN-8-EP(6x8)
W25X10CLSNIG-TR
WINBOND(华邦)
SOIC-8
W25Q256JVFAM
WINBOND(华邦)
SOIC-16-300mil
W25Q32JVUUIQ
WINBOND(华邦)
USON-8(3x4)
W25Q16JWXHIQ
WINBOND(华邦)
XSON-8-EP(2x3)
GD25Q128ESIG
GigaDevice(兆易创新)
SOP-8-208mil
W25Q80DVUXIE
WINBOND(华邦)
USON-8-EP(2x3)
MT25QL512ABB8ESF-0AAT TR
micron(镁光)
SO-16-300mil
MT25QL01GBBB8ESF-0SIT TR
micron(镁光)
SO-16-300mil
MT25QL256ABA8E12-1SIT TR
micron(镁光)
TPBGA-24(6x8)
GD25Q16ESIG
GigaDevice(兆易创新)
SOP-8-208mil
PM25LQ020B-SCE
ISSI(美国芯成)
SOIC-8
GD25Q80ESIG
GigaDevice(兆易创新)
SOP-8-208mil
MT25QU512ABB8ESF-0SIT TR
micron(镁光)
SO-16-300mil
MT25QU01GBBB8ESF-0SIT
micron(镁光)
SO-16-300mil
PM25LQ512B-SCE
ISSI(美国芯成)
SOIC-8
PM25LQ010B-SCE
ISSI(美国芯成)
SOIC-8
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