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型号
品牌
封装
RJGT102WDT6
Runjet(瑞纳捷)
SOT-23-6
MKM04EL04TD2-TN
MK(米客方德)
-
K4F8E304HB-MGCJT
SAMSUNG(三星半导体)
FBGA
K4F6E3S4HM-MGCJT
SAMSUNG(三星半导体)
FBGA
SD16S1Y
SHOUDING(首鼎半导体)
SOT-23-6
FM25640B-GA
CYPRESS(赛普拉斯)
SOIC-8
FM25C160B-GA
CYPRESS(赛普拉斯)
SOIC-8
FM25V01-GTR
CYPRESS(赛普拉斯)
SOIC-8
FM24C16B-G1
RAMTRON
SOIC-8
FM24V02-G
CYPRESS(赛普拉斯)
SOIC-8
FM25040B-GA
CYPRESS(赛普拉斯)
SOIC-8
ZD53D16GA062FA
Zetta(澜智)
Ball-200
M13S2561616A-5TG2S
ESMT(晶豪)
TSOP-66-10.2mm
RS256M16ZADD-75DT
Rayson(晶存)
FBGA-96(7.5x13.5)
M14D5121632A-2.5BG2A
ESMT(晶豪)
BGA-84(8x12.5)
M13S128168A-5TG2N
ESMT(晶豪)
TSOP-66-10.2mm
MKRD3B25616HG13AB
MK(米客方德)
FBGA-96
RS128M32LD3D1LMZ-125BT
Rayson(晶存)
FBGA-178
RS256M32LD3D1LMZ-125BT
Rayson(晶存)
FBGA-178
RS512M32LD3D2LMZ-125BT
Rayson(晶存)
FBGA-178
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