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型号
品牌
封装
W632GG8MB-12 TR
WINBOND(华邦)
78-VFBGA（10.5x8）
W632GG8MB-11 TR
WINBOND(华邦)
78-VFBGA（10.5x8）
W632GG6MB15I TR
WINBOND(华邦)
96-VFBGA（7.5x13）
W632GG6MB-15 TR
WINBOND(华邦)
96-VFBGA（7.5x13）
W632GG6MB12I TR
WINBOND(华邦)
96-VFBGA（7.5x13）
W632GG6MB-11 TR
WINBOND(华邦)
96-VFBGA（7.5x13）
DS2433X-300-EC+
ADI(亚德诺)/MAXIM(美信)
6-覆晶（2.82x2.54）
RM25C64DS-LTAI-T
Adesto Technologies
8-TSSOP
RM25C64DS-LSNI-T
Adesto Technologies
8-SOIC
RM25C32DS-LTAI-T
Adesto Technologies
8-TSSOP
RM25C32DS-LSNI-T
Adesto Technologies
8-SOIC
RM25C256DS-LTAI-T
Adesto Technologies
8-TSSOP
RM25C256DS-LSNI-T
Adesto Technologies
8-SOIC
RM25C128DS-LTAI-T
Adesto Technologies
8-TSSOP
RM25C128DS-LSNI-T
Adesto Technologies
8-SOIC
RM24C256DS-LTAI-T
Adesto Technologies
8-TSSOP
RM24C256DS-LSNI-T
Adesto Technologies
8-SOIC
RM24C128DS-LTAI-T
Adesto Technologies
8-TSSOP
RM24C128DS-LSNI-T
Adesto Technologies
8-SOIC
RM24C64DS-LTAI-B
Adesto Technologies
8-TSSOP
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